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Good news! MST's 2.5D/3D advanced packaging equipment has started hoisting!

MST showcased its technology at CFCF2025, exploring the new trends in advanced packaging of optoelectronic modules!

Good news! The first batch of advanced equipment from MST has arrived, marking the beginning of a new journey in high-end advanced chip packaging.

Mr. Wang Xin, CTO of MST: Exploring Cutting-Edge Chip Packaging at NEPCON – Showcasing Innovative Solutions and Strategies.

Development Trends of Low-Density Packaging

The Importance of Semiconductor Packaging and Its Application Fields

Microsilicon Technology (Gaoyou) Integrated Circuit Co., Ltd.

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86-17788564060

86-0514-84651836

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hr@microsilicontech.com

sales@microsilicontech.com

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Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City

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No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City

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Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd

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MST provides a complete solution for wafer-level fan-out advanced packaging

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