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RDL+Bumping wafer bumping

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Mr. Wang Xin, CTO of MST: Exploring Cutting-Edge Chip Packaging at NEPCON – Showcasing Innovative Solutions and Strategies.

Development Trends of Low-Density Packaging

The Importance of Semiconductor Packaging and Its Application Fields

China's chip packaging technology

Failure analysis techniques and applications for high-density packaging

SMIC, the world's second-largest chipmaker, surpasses US$8 billion in revenue for the first time!

Microsilicon Technology (Gaoyou) Integrated Circuit Co., Ltd.

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86-17788564060

86-0514-84651836

Email:

hr@microsilicontech.com

sales@microsilicontech.com

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Office Address:

Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City

Factory Address:

No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City

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Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd

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> WLCSP

> Fan-out

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