- Product Description
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Product Introduction:
Wafer bumping is an advanced wafer-level packaging technology that employs copper pillar/tin solder bump interconnections to establish connections between chips and their packages. This serves as a replacement for conventional wire bonding technology.
MST possesses the full capability to provide both 8-inch and 12-inch wafer bumping foundry services for our valued customers. Our comprehensive solutions encompass high-density copper pillar electroplated bumps and fine line-width/line-space redistribution layer (RDL) ball placement technologies, specifically designed to address the diverse requirements of our clientele.
Process Capabilities:
▪ Wafer size: 8inch/12 inch
▪ Repassivation types: PI
▪ RDL layer: 3 layers
▪ Metal types: Sputtering Ti/Cu, Plating Cu RDL, plating Cu/Ni/SnAg bump
▪ RDL L/S: ≥ 4um/4um
▪ Bump size: >30um
▪ Bump pitch: >60 um
Keywords:
RDL+Bumping wafer bumping
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Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City
Factory Address:
No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City
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Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd
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