- Product Description
-
Product Introduction:
Mobile terminal electronic products are placing increasingly comprehensive demands on chip performance, dimensional space, power consumption and cost. Wafer-level chip scale packaging (WLCSP) fully leverages our silicon wafer processing technological advantages to provide customers with higher interconnect density, stronger chip performance, more optimized power consumption management, and smaller, thinner and more compact package structures compared to traditional chip packaging solutions. This technology has gained widespread application particularly in market segments such as mobile terminals and wearable devices.
MST delivers premium professional services in wafer-level chip scale packaging (WLCSP) technology for all IC design companies and end-product customers. We are capable of fulfilling diverse product and process requirements from global clients. With particular expertise in the rapidly growing Low-K product market, we possess mature and complete laser grooving process technology solutions. Additionally, MST can provide wafer dicing services according to customer specifications, with flexible packaging options including tray or reel-to-reel delivery methods.
Process Capabilities:
▪ Wafer size: 8inch/12 inch
▪ Repassivation types: PI
▪ Die size: 0.2*0.4 mm~25x25 mm
▪ RDL layer: 1~3 layers
▪ Metal types: Sputtered Ti/Cu、TiW/Cu , Plated Cu、Ni、SnAg
▪ RDL L/S: ≥ 4um/4um
▪ Ball pitch: ≥0.20mm
▪ Ball size: ≥0.150mm
Keywords:
WLCSP wafer-level packaging
Request a Quote
We will contact you within one working day. Please pay attention to your email.
Related Products
Contact Us
Hotline:
Company Address
Office Address:
Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City
Factory Address:
No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City
WeChat Official Account
Follow us
Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd
Copyright © Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd