2025/04/23

Mr. Wang Xin, CTO of MST: Exploring Cutting-Edge Chip Packaging at NEPCON – Showcasing Innovative Solutions and Strategies.

On April 22nd, at the NEPCON exhibition held in Shanghai, Mr. Wang Xin, CTO of MST, was invited to deliver a keynote speech, engaging with industry leaders to explore the latest advancements in chip packaging technology.


2024/12/13

Innovation: Unveiling Microsilicon Technology's Chilpet Packaging Solution

On December 11, the Shanghai Integrated Circuit 2024 Industrial Development Forum and the 30th Integrated Circuit Design Industry Exhibition opened at the Shanghai World Expo Exhibition and Convention Center. Focusing on the theme of "Smart Shanghai, a World of Chips," the event brought together experts to discuss the future landscape of the integrated circuit industry.


2024/08/08

Good News | Microsilicon Technology Awarded 'Jiangsu Province Intelligent Manufacturing Workshop' Title

In August 2024, the Jiangsu Provincial Department of Industry and Information Technology officially released the list of Jiangsu Province's intelligent manufacturing workshops for 2024. Thanks to its outstanding practices and technological innovations in intelligent manufacturing, Microsilicon Technology successfully won the title of "Jiangsu Province Intelligent Manufacturing Workshop." This signifies that the company's technological strength in high-end manufacturing has received authoritative recognition and marks a solid step forward in promoting the intelligent transformation of the manufacturing industry.


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MST provides a complete solution for wafer-level fan-out advanced packaging

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