Mr. Wang Xin, CTO of MST: Exploring Cutting-Edge Chip Packaging at NEPCON – Showcasing Innovative Solutions and Strategies.
On April 22nd, at the NEPCON exhibition held in Shanghai, Mr. Wang Xin, CTO of MST, was invited to deliver a keynote speech, engaging with industry leaders to explore the latest advancements in chip packaging technology.
On April 22nd, at the NEPCON exhibition held in Shanghai, Mr. Wang Xin, CTO of MST, was invited to deliver a keynote speech, engaging with industry leaders to explore the latest advancements in chip packaging technology.
In the AI era, the demand for computing power in processor chips and modules (e.g., HPC, SoC, AP) is surging, making Chiplet an increasingly mainstream approach due to its design and manufacturing efficiency. However, integrating chiplets presents numerous technical challenges.Mr. Wang Xin pointed out that AI chips, as key enablers of AI applications, face multi-dimensional challenges in computing power, memory bandwidth, and I/O density, which collectively shape the technological landscape of AI chips.To address these challenges, MST provides customized packaging solutions for AI/HPC chips and consumer electronics. For example, its Fobic Silicon Bridge Integration Solution enables submicron interconnections, while the FOSiP Packaging Solution supports ultra-fine wiring (2-5μm), catering to diverse customer needs and driving advancements in AI chip technology.
Notably, MST highlighted its self-developed MST Fobic Embedded Silicon Bridge Fan-Out Solution during the speech. This solution delivers both high performance and cost efficiency. Mr. Wang Xin provided a detailed analysis of its packaging architecture, process flow, and performance advantages, offering fresh insights and solutions for the industry.
In the concluding segment, MST also shared its comprehensive packaging solutions, spanning from mid/low-density to high-density Chiplet integration, demonstrating the company’s extensive expertise and strategic positioning in advanced packaging.
The exhibition attracted significant attention from across the supply chain, bringing together professionals from OSAT firms, equipment/material suppliers, EDA solution providers, and module manufacturers. Attendees showed strong interest in MST's innovations, fostering dynamic discussions on-site.
MST's impactful presentation at NEPCON not only showcased its leadership in advanced packaging but also contributed significantly to technological progress and industry collaboration. Moving forward, MST will continue to drive innovation in semiconductor packaging.
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