Good news! MST's 2.5D/3D advanced packaging equipment has started hoisting!
On June 25th, with the first advanced 2.5D/3D packaging equipment slowly rising under the precise control of professional engineers, MST's advanced packaging production line upgrade project officially entered the equipment installation phase! The launch of this key node marks a substantial step forward in the company's layout in the field of 2.5D/3D advanced packaging technology, laying a solid foundation for the subsequent realization of high-density integration at the sub-micron level.
At the strictly regulated installation site, the engineering team provided full supervision to ensure the safe and precise positioning of the equipment:
Precise Installation: A customized installation plan was adopted to ensure zero damage to the high-value equipment during installation.
Scientific Layout: Optimizing the equipment production line space configuration based on the needs of advanced packaging processes.
Intelligent Joint Debugging: Equipment debugging was started immediately after installation to shorten the production cycle.
The advanced packaging equipment installed this time has industry-leading performance:
Advanced Optical Wafer Debonding: Used to achieve low-stress, high-reliability multilayer thin-film wiring.
Multi-Dimensional Heterogeneous Integration: Supports D2W bonding of 2.5D interposers or silicon bridges, as well as 3D chip stacking structures.
Ultra-Precision Machining: Using CMP, plasma processing, and other methods to achieve high-precision interconnect packaging at the sub-micron level.
Special Processes: Utilizing laser cleaning, ultra-thin restructured wafers, and a series of special process technologies to assist in ultra-high-density Chiplet integration.
As the subsequent equipment is gradually installed, the company will accelerate the production line verification and customer sample production, deepen technical cooperation with upstream and downstream partners, and continuously expand the boundaries of advanced packaging technology.
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