MST debuts at SEMI-e Shenzhen International Semiconductor Exhibition — Winning attention with technology, driving the future with strength!
Industry Event Focuses, MST Shines with Strength
In September 2025, the SEMI-e Shenzhen International Semiconductor Exhibition and 2025 Integrated Circuit Industry Innovation Exhibition were grandly held at the Shenzhen International Convention and Exhibition Center. As the annual event of the integrated circuit industry, this exhibition gathered leading global companies and cutting-edge technologies. MST made a strong debut with its core achievements, attracting a high level of interest at the booth and becoming a major highlight of the exhibition hall.
Deepening Advanced Packaging, Empowering the Future of Chips
MST has long focused on wafer-level fan-out advanced packaging platforms, building a one-stop service capability covering "design simulation—technology development—product certification—packaging and testing." During the exhibition, we highlighted MST's Chiplet Integration small chip system integration, FOSiP packaging system integration, and wafer-level testing/packaging integrated solutions. These achievements not only demonstrate MST's technical accumulation in advanced packaging but also reflect our strategic determination to promote independent innovation in the domestic semiconductor industry.
Technology and Market Resonance, Earning Industry Trust
The booth was crowded with visitors, including customers, partners, and representatives from research institutes, engaging in in-depth exchanges around wafer samples and solutions. From cooperation intentions to application scenarios, from mass production feasibility to future planning, the atmosphere was enthusiastic and pragmatic. MST earned widespread recognition through the professional team's detailed explanations and technical strength, with many customers clearly expressing expectations for further cooperation.
Building an Innovative Ecosystem Together, Collaborating for Win-Win Outcomes
MST deeply understands that breakthroughs in advanced packaging technology rely not only on isolated innovation but also on collaboration across the upstream and downstream of the industry chain. Leveraging the international platform of SEMI-e, we look forward to partnering with more collaborators to promote integrated development of the industry chain and jointly build a globally competitive innovation ecosystem. In the future, MST will continue to take technological innovation as the core driving force to help the integrated circuit industry advance to a higher quality development stage.
Highlights Review
Booth Information: Shenzhen International Convention and Exhibition Center, Booth 16F128
Exhibition Dates: September 10–12, 2025
The exhibition is still in full swing. Welcome to visit the MST booth and communicate with us face to face!
Discussing the Future of Chips Together
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