2025/04/02

Development Trends of Low-Density Packaging

Low-density packaging is a key technology in the field of electronics manufacturing. With the rapid development of technology, its application in integrated circuits, semiconductors, electronic devices, and many other fields is becoming increasingly widespread. Low-density packaging is not only related to product performance but also to product reliability and durability. Therefore, its development trend has attracted much attention.

2025/04/02

The Importance of Semiconductor Packaging and Its Application Fields

Semiconductor technology is the core of modern electronics industry, and semiconductor packaging is an indispensable part of this technology. The main purpose of semiconductor packaging is to protect semiconductor chips and make them adaptable to the external environment, ensuring smooth current transmission, thus achieving normal operation of the equipment. With the rapid development of science and technology, the importance of semiconductor packaging is becoming increasingly prominent, and its application fields are also continuously expanding.

2025/04/01

China's chip packaging technology

With the trend of electronic products developing towards miniaturization, high density, multi-functionality, and ultra-thinness, semiconductor packaging technology has become an important means of achieving miniaturization and lightweight of electronic products. Packaging processes have evolved from ordinary thin-film processes to high-density interconnect technologies, and from low-performance device packaging to high-performance device packaging, playing a crucial role in the technological advancement of the semiconductor industry and national economic construction.

2025/03/31

Failure analysis techniques and applications for high-density packaging

High-density packaging technology has developed rapidly in recent years, bringing new challenges to the failure analysis process. Conventional failure analysis methods are difficult to meet the analysis needs of high-density packaging with complex structures and small linewidths, requiring adjustments and improvements to the analysis methods based on the specific analysis object. This paper introduces failure analysis technologies such as X-ray, computed tomography (CT), microprobe, and multi-method combination, analyzes their principles and advantages applicable to high-density packaging. Combined with two failure analysis cases of high-density packaging, this paper specifically introduces their use stages and application methods in the cases, successfully finding the cause of failure. Finally, the advantages, disadvantages, and applicable scope of each method in the failure analysis of high-density packaging are summarized.

2025/02/11

SMIC, the world's second-largest chipmaker, surpasses US$8 billion in revenue for the first time!

On the evening of February 11, 2025, SMIC, the leading foundry in mainland China, released its Q4 2024 financial report. Sales revenue reached a new high of $2.07 billion, a 1.7% increase month-on-month. Gross margin was 22.6%, up 2.1 percentage points month-on-month. Annual revenue exceeded $8 billion for the first time, further solidifying its position as the world's second-largest pure-play foundry.

2021/11/12

Key Heterogeneous Integration in Advanced Packaging, RDL Process Faces More Challenges

Heterogeneous integration is increasingly becoming key to semiconductor innovation, with advanced packaging technologies helping to improve the value, increase functionality, maintain and enhance performance, and reduce costs of semiconductor products.

2021/11/11

Semiconductor Bonding Equipment Industry In-depth Analysis: Advanced Packaging and High-Density Interconnection Drive Bonding Technology Development, Domestic Equipment Continues to Make Breakthroughs

High-density packaging is an advanced integrated circuit packaging technology that can integrate more chips into a smaller package, thereby improving the integration and performance of the device. The main advantages of this technology include higher integration, smaller size, higher performance, and lower energy consumption.

2021/11/09

Advantages of hybrid bonding die bonding: A new method to improve the efficiency of semiconductor devices

In today's rapidly developing technological era, the efficiency of semiconductor devices is a key focus across various industries. Imagine the excitement if we could enhance the efficiency of these devices through a new technology! Today, let's discuss the advantages of "hybrid bonding die bonding".

2021/10/31

High-density packaging technology: improving integration and performance

High-density packaging is an advanced integrated circuit packaging technology that can integrate more chips into a smaller package, thereby improving the integration and performance of the device. The main advantages of this technology include higher integration, smaller size, higher performance, and lower energy consumption.