With the trend of electronic products constantly developing towards miniaturization, high density, multi-functionality, and ultra-thinness, semiconductor packaging technology has become an important technological means to achieve miniaturization and lightweight of electronic products. Packaging technology has developed from ordinary thin-film technology to high-density interconnection technology, and from low-performance device packaging to high-performance device packaging, playing a crucial role in the technological progress of the semiconductor industry and national economic construction.

　　At present, major microelectronic chip manufacturers internationally almost all have their own interconnection packaging production lines. Currently, semiconductor industry manufacturers in China have also gradually mastered the key technologies of interconnection, including chip manufacturing, chip packaging and testing, and surface mount technology. However, in the integrated circuit manufacturing process, due to the large number of processes, steps, methods, and parameters involved, interconnection is a very complex, precise, and long-term production process.

　　China's semiconductor chip manufacturing industry is currently facing some problems:

　　1. Currently, the development of interconnection in domestic semiconductor industry enterprises is unbalanced;

　　2. The structure of the semiconductor industry is unreasonable, and the industrial supporting facilities are insufficient;

　　3. The technological level of relevant domestic enterprises in China is backward, and the market competitiveness is weak.

　　China's integrated circuit industry still has a gap with the international advanced level in the international market. At present, China's integrated circuit industry still needs to greatly improve in aspects such as high-precision packaging, especially in high-end integrated circuit packaging. From the development trend, the gap between China's integrated circuit industry and the international advanced level in terms of product cost will further narrow;

　　However, it faces enormous pressure in terms of technology. With the advancement and development of microelectronics technology and microelectromechanical systems (MEMS) technology, domestic IC packaging is also undergoing tremendous changes: Taking integrated circuit chips as an example: As the device size and interconnect line density continue to increase, the interconnection between chips has become one of the most important factors determining its performance;

　　In addition, high-density packaging (Hybrid Filing) has been widely developed in recent years. Therefore, as the device size increases, the area increases, and the thickness becomes thinner, the interconnection size becomes one of the most important factors determining device performance; while under the same size, the interconnect line density and interconnect area are important factors affecting system power consumption, cost, and reliability.

　　Therefore, integrated circuit packaging technology is a new type of technology that emerged to meet the requirements of miniaturization and lightweight of electronic products under the development trend of miniaturization, high density, and ultra-thinness of modern electronic products.

　　Integrated circuit packaging mainly includes the following steps: chip manufacturing, chip testing, IC packaging (insertion), and after the chip manufacturing is completed, the packaged IC needs to be installed. Because IC packaging technology involves many factors, such as materials (mainly ceramic materials), mechanical processing equipment (mainly processing platforms), and process control systems (mainly temperature control systems), etc.

　　Therefore, IC packaging includes the manufacturing process, testing process, and installation process that need to be carried out in the chip production process. Currently, TSMC has the strongest global production capacity, with advanced processes and strong R&D capabilities; while SMIC is the largest design company in China.

　　At present, there is a certain gap between China and the world's advanced level in integrated circuit packaging technology: Taking integrated circuit chips as an example:

　　1. The development of the domestic IC packaging industry is unbalanced, especially in the mid-to-high-end fields, the development is relatively backward;

　　2. The overall scale of the domestic semiconductor integrated circuit design industry is small, and there is a lack of leading enterprises;

　　3. Domestic semiconductor integrated circuit manufacturing equipment in China is backward;

　　4. There is a shortage of talents in domestic IC integrated circuit design companies in China, and the comprehensive R&D capabilities are low;

　　5. The overall level of domestic IC manufacturing technology in China is relatively low.

　　However, with the support of national policies and the intensification of international market competition. In the future, with the development of electronic products towards miniaturization, high density, and multi-functionality, and the continuous progress of integrated circuit manufacturing technology, future chip manufacturing capabilities will be further enhanced (such as advanced packaging technology);

　　Therefore, the future development of the domestic IC industry will be even more rapid. According to the Counterpoint report (hereinafter referred to as "CEC"), it is estimated that the global semiconductor market was worth US$66 billion in 2014, including US$53 billion in packaging and testing equipment spending (approximately 9.8% of the total market share); In 2014, the sales of packaging and testing equipment in the global semiconductor product sales amounted to approximately US$19 billion (approximately 8.6% of the total market share).

　　This shows that China's semiconductor industry currently still belongs to the mid-to-low-end industry in the world, mainly occupied by foreign companies.

　　According to statistics from the Semiconductor Industry Association, in 2014, in the global packaging and testing market sales, the chip manufacturing market sales, mainly packaging products, were US$12.8 billion, of which packaging and testing products accounted for 65% of the entire market (approximately US$12 billion).

　　The development of related industries in China is relatively lagging, mainly focusing on mid-to-low-end chip manufacturing, with low product quality and small scale, and a large gap with the international advanced level.

　　At present, the packaging industry suffers from serious overcapacity, relatively backward technology, and small enterprise scale. These problems will become increasingly prominent in future development.

　　Therefore, effective measures must be taken to solve the above-mentioned problems in the industry:

　　First, we should strengthen the management of the IC industry, encourage industrial innovation and independent innovation. Encourage and guide integrated circuit design companies and packaging and testing companies to participate in domestic market competition, and improve packaging capabilities and levels.

　　Secondly, strengthen the supervision and management of integrated circuit packaging technology and product quality, and strengthen the construction of relevant laws and regulations.

　　Third, strengthen the training of IC industry talents and enhance the attractiveness to excellent domestic and foreign talents.

　　Fourth, increase the introduction of production equipment from foreign IC companies and domestic IC design companies.

　　Fifth, vigorously support the independent innovation and brand building of the IC design industry, encourage the R&D capability improvement of the IC manufacturing and packaging and testing industry, improve the overall technological innovation capability and R&D level of the industry, and cultivate and strengthen the development momentum of semiconductor enterprises.

　　Finally, it is hoped that this can contribute to the development of China's integrated circuit industry and enable our country to become one of the world's powerful countries!