Development History

2021

2020~2024

Phase one of the production line has landed in Yangzhou, Jiangsu, with a total investment of 570 million yuan and officially commenced mass production in September 2023. Meanwhile, Hangzhou Microsilicon Technology has been recognized as a high-tech enterprise and a provincial specialized, refined, and new enterprise.

2020~2024 Image Name

2018~2019

Hangzhou Microsilicon Technology Co., Ltd. has completed tens of millions of PRE-A round financing with the introduction of industrial fund China Electronics HaiKang and equity investment fund Zhejiang Hurong.

2018~2019 Image Name

2016~2017

Microsilicon Technology, formerly Zhejiang Zhuojing, launched China's first multi-chip fan-out packaging chip. Zhuojing's debut.

2016~2017 Image Name

2010~2016

The founding team of Microsilicon Technology provides R&D services and mass production support to global wafer-level fan-out giants.

2010~2016 Image Name

MST provides a complete solution for wafer-level fan-out advanced packaging

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