About MST
MST provides a complete solution for wafer-level fan-out advanced packaging
Founded in July 2018, MST is a high-tech enterprise dedicated to innovation in wafer-level advanced packaging technologies. We leverage our independently developed and controlled fan-out wafer-level packaging technology platform to deliver high-performance Chiplet integration solutions. With a comprehensive technology portfolio encompassing bumping, WLCSP, fan-out, SiP and 2.5D/3D chiplet integration, we provide global clients with highly reliable and densely integrated advanced packaging services, accelerating the innovation of next-generation high-performance chips.
Our proprietary technology system includes nearly 100 independent intellectual property rights. We offer solutions across three key product dimensions:
· Ultra-High-Density Packaging: Pushing the limits of traditional packaging for HPC chips, server CPUs/GPUs/XPUs and computer/tablet processors.
· Mid-to-High-Density Packaging: Targeting SoC chips for smartphones, wearables (bands/watches), AR/VR, medical and defense applications.
· Low-Density Packaging: Optimized for FOSiP system-level packaging of PMICs, basebands, RF/Wi-Fi, mmWave chips and IoT modules.
Our technical team has been deeply immersed in the field of advanced packaging for over a decade. The core members come from globally leading semiconductor corporations and prestigious R&D institutions, possessing profound technical expertise in package solution design, simulation, process development and production line management.
Leveraging our extensive experience in advanced package design, precise simulation verification capabilities, strong process development competencies and high-efficiency production management systems, we have successfully overcome critical technical challenges in packaging products, including warpage control, die shift mitigation, reconstituted wafer integration and ultra-high-density interconnects. These achievements fully demonstrate MST's exceptional craftsmanship and remarkable capabilities in the field of advanced packaging.
Corporate Culture
Corporate Vision
Dedicated to becoming a domestic benchmark solution provider in the field of wafer-level ultra-high-density advanced packaging technology
Corporate Mission
Leading the global system-level advanced packaging in the post-Moore era
Corporate Values
Innovation, Struggle, Altruism
Corporate Policy
Customer First, Excellence, Continuous Improvement, Continuous Enhancement
Contact Us
Hotline:
Company Address
Office Address:
Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City
Factory Address:
No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City
WeChat Official Account
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Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd
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