MST Introduction
MST provides a complete solution for wafer-level fan-out advanced packaging and chiplet packaging solutions.
Fan-out wafer-level advanced packaging technology has the ability to integrate 5-7nm and below node chip stacking, enabling multi-chip packaging (FOSiP) and 2.5D/3D integration to achieve the goals of minimum size, minimum thickness, low power consumption, and high performance.
FOSiP Advantages
01
High degree of customization: Different fan-out packaging methods such as face up and face down can be customized to meet different packaging accuracy requirements and realize 2.5D/3D stacking packaging;
02
Thin-film routing is used for chip interconnection. Compared with traditional substrate or lead frame methods, the package is thinner, smaller in area, and has superior electrical performance.
03
The minimum line width and spacing of RDL routing can reach 1~2um, which is at the advanced level of the industry and can meet the needs of high-density interconnection.
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Hotline:
Business Contact
Company Address
Office Address:
Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City
Factory Address:
No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City
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Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd
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