MST showcased its technology at CFCF2025, exploring the new trends in advanced packaging of optoelectronic modules!
In his speech, Mr. Deng focused on MST's innovative applications in the optoelectronic module field, especially CPO (Co-Packaged Optics) and OIO (Optical I/O) technologies. With the continuous increase in data center transmission rates, the signal loss problem of traditional optical modules is becoming increasingly prominent. CPO technology, by integrating the optical engine and computing chip, significantly reduces power consumption and latency, making it key to future high-speed data transmission.MST's optoelectronic packaging solutions cover all scenarios from low to medium and high density, and even Chiplet integration, meeting the stringent requirements of AI data centers and high-performance computing.
Regarding market trends, Mr. Deng cited authoritative data indicating that the CPO market is experiencing explosive growth, with an estimated market size of US$8.1 billion by 2030 and a compound annual growth rate as high as 137%. This growth is driven by the huge computing power demand of AI large model training and the accelerated commercialization of CPO technology by leading chip manufacturers. MST is keeping pace with the market and has launched several optoelectronic packaging products to meet the demand for high-speed, low-power transmission in data centers and high-performance computing.
Furthermore, in terms of technological development trends, Mr. Deng pointed out that increasing single-channel SerDes rates, reducing the cost of silicon photonic materials, and 3D heterogeneous integration will become mainstream directions. However, CPO technology still needs to overcome challenges such as achieving high yield, ensuring signal integrity, and optimizing thermal management. MST, with its deep accumulation in fan-out and WLP, is committed to breaking through these technological bottlenecks and promoting the development of CPO technology to a higher level.
Participating in CFCF2025, MST not only showcased its technological strength but also collaborated with industry peers to promote the innovative upgrading of the optoelectronic module industry. In the future, MST will continue to cultivate the advanced packaging field and inject new vitality into the optoelectronic module industry.
(Optoelectronic Packaging Solution)
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