Good news! The first batch of advanced equipment from MST has arrived, marking the beginning of a new journey in high-end advanced chip packaging.
Today marks a milestone for MST with the arrival of its first batch of advanced 2.5D/3D packaging equipment! This significant event represents a crucial step for MST in the field of advanced packaging, signifying the company's establishment of a complete technological system encompassing bumping, WLCSP, Fan-out, SIP, and 2.5D/3D chiplet integration. This allows the company to provide domestic and international leading clients with high-reliability, high-integration, and high-end advanced packaging services for CPU, GPU, edge computing HPC, and AP/SoC/processor chips or modules for smart terminals such as mobile phones and computers, thereby strongly promoting the innovative development of the new generation of high-performance chips. Relevant city officials were present to witness this important moment with company management.
The equipment includes 11 units, such as laser debonding equipment from Japan's Tazmo and Dongtai laser drilling machines. These machines will be gradually put into production over the next 2-3 weeks. These advanced machines integrate cutting-edge technologies and offer significant advantages in terms of high precision, high efficiency, and high stability.
MST has always focused on the research and development and innovation of advanced chip packaging technology. The company understands that in today's rapidly developing chip industry, advanced packaging technology is a key factor in improving chip performance, reducing costs, and driving industrial upgrading. The introduction of this 2.5D/3D advanced packaging equipment is an important measure for the company's technological upgrade.
By introducing this advanced equipment, MST will be better able to meet the needs of leading domestic clients for high-performance chip packaging and chiplet integration.
The arrival of this 2.5D/3D mass production equipment marks the transition of MST's high-end advanced packaging from research and development to production, breaking the monopoly of international giants in the advanced packaging sub-sector, especially ushering in the era of sub-micron interconnect density chiplet integration packaging. In the future, we will fully leverage the advantages of this equipment, continuously optimize packaging processes, improve product quality, and provide customers with even better chip packaging services.
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