Good News | Microsilicon Technology Awarded 'Jiangsu Province Intelligent Manufacturing Workshop' Title

In August 2024, the Jiangsu Provincial Department of Industry and Information Technology officially released the list of Jiangsu Province's intelligent manufacturing workshops for 2024. Thanks to its outstanding practices and technological innovations in intelligent manufacturing, Microsilicon Technology successfully won the title of "Jiangsu Province Intelligent Manufacturing Workshop." This signifies that the company's technological strength in high-end manufacturing has received authoritative recognition and marks a solid step forward in promoting the intelligent transformation of the manufacturing industry.

　　In August 2024, the Jiangsu Provincial Department of Industry and Information Technology officially released the list of Jiangsu Provincial Smart Manufacturing Workshops for 2024. Thanks to its outstanding practices and technological innovations in intelligent manufacturing, Microsilicon Technology successfully won the title of "Jiangsu Provincial Smart Manufacturing Workshop." This signifies the authoritative recognition of the company's technological strength in high-end manufacturing and represents a solid step forward in promoting the intelligent transformation of the manufacturing industry.

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Innovation: Unveiling Microsilicon Technology's Chilpet Packaging Solution

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Mr. Wang Xin, CTO of MST: Exploring Cutting-Edge Chip Packaging at NEPCON – Showcasing Innovative Solutions and Strategies.

On April 22nd, at the NEPCON exhibition held in Shanghai, Mr. Wang Xin, CTO of MST, was invited to deliver a keynote speech, engaging with industry leaders to explore the latest advancements in chip packaging technology.

Development Trends of Low-Density Packaging

Low-density packaging is a key technology in the field of electronics manufacturing. With the rapid development of technology, its application in integrated circuits, semiconductors, electronic devices, and many other fields is becoming increasingly widespread. Low-density packaging is not only related to product performance but also to product reliability and durability. Therefore, its development trend has attracted much attention.

The Importance of Semiconductor Packaging and Its Application Fields

Semiconductor technology is the core of modern electronics industry, and semiconductor packaging is an indispensable part of this technology. The main purpose of semiconductor packaging is to protect semiconductor chips and make them adaptable to the external environment, ensuring smooth current transmission, thus achieving normal operation of the equipment. With the rapid development of science and technology, the importance of semiconductor packaging is becoming increasingly prominent, and its application fields are also continuously expanding.

Microsilicon Technology (Gaoyou) Integrated Circuit Co., Ltd.

Hotline:

86-17788564060

86-0514-84651836

Email:

hr@microsilicontech.com

sales@microsilicontech.com

Company Address

Office Address:

Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City

Factory Address:

No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City

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Microsilicon Technology (Gaoyou) Chip Integration Co., Ltd

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