Design and simulation services
- Commodity name： Design and simulation services
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- Product Description
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Design simulation is critically important for formulating and delivering advanced packaging solutions. It conducts fundamental simulation evaluations of packaging designs from stress, electrical performance, and thermal perspectives prior to prototyping, while collaborating with process, materials, and equipment teams to optimize packaging solutions. This capability is essential for high-end advanced packaging and testing facilities.
Before submitting customized Fan-out wafer-level advanced packaging solutions to production lines for manufacturing, professional EDA engineering software tools must first perform simulations for preliminary verification and optimization. This ensures the final packaging solution meets customer performance requirements for the packaged chips or modules. Typical simulations mainly include the following aspects:
1. Mechanical Simulation: Mechanical strength of packaged chip modules, warpage of reconstituted wafers, stress distribution, etc.
2. Thermal Simulation: Heat generation and temperature distribution of packaged chip modules under specified power conditions.
3. Electrical Simulation: Power consumption, RF transmission efficiency, noise interference, signal integrity, and power integrity of chip modules, etc.
Keywords:
Design and simulation services
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Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City
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No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City
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