- Product Description
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Product Introduction:As a cutting-edge packaging technology, Fan-Out Packaging primarily achieves higher-density electrical interconnections by redistributing and connecting the input/output (I/O) pins on the chip to a wider external circuit. This technology offers distinct technical advantages including high integration density, excellent electrical performance, and superior thermal management.
Application Areas: Fan-Out Packaging is widely adopted in high-end electronic devices, particularly in: 5G communications, data centers, artificial intelligence processors, automotive electronics, internet of Things (IoT)，consumer electronics.
In these fields, its advantages are mainly reflected in: enhanced device performance, reduced power consumption, compact form factor and improved heat dissipation. These benefits make Fan-Out Packaging an indispensable solution in modern electronic technologies.
Process Capabilities:
▪ FO size: max 25x50mm
▪ RDL L/S: min 2/2um with fan out，can go down to 0.5um if with Bridge Die intercommenction
▪ RDL layer: up to 4 or 5 layers
▪ Package types：single chip FO、multi-chip FO SiP、2.5D/3D FO、
▪ Metal types：Sputtered Ti/Cu、TiW/Cu , Plated Cu、Ni、SnAg
▪ Solder ball pitch：>0.30mm
Keywords:
Fan-out PoP stack packaging
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No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City
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