Wafer bumping is an advanced wafer-level packaging technology that employs copper pillar/tin solder bump interconnections to establish connections between chips and their packages. This serves as a replacement for conventional wire bonding technology.

MST possesses the full capability to provide both 8-inch and 12-inch wafer bumping foundry services for our valued customers. Our comprehensive solutions encompass high-density copper pillar electroplated bumps and fine line-width/line-space redistribution layer (RDL) ball placement technologies, specifically designed to address the diverse requirements of our clientele.

Mobile terminal electronic products are placing increasingly comprehensive demands on chip performance, dimensional space, power consumption and cost. Wafer-level chip scale packaging (WLCSP) fully leverages our silicon wafer processing technological advantages to provide customers with higher interconnect density, stronger chip performance, more optimized power consumption management, and smaller, thinner and more compact package structures compared to traditional chip packaging solutions. This technology has gained widespread application particularly in market segments such as mobile terminals and wearable devices.

MST delivers premium professional services in wafer-level chip scale packaging (WLCSP) technology for all IC design companies and end-product customers. We are capable of fulfilling diverse product and process requirements from global clients. With particular expertise in the rapidly growing Low-K product market, we possess mature and complete laser grooving process technology solutions. Additionally, MST can provide wafer dicing services according to customer specifications, with flexible packaging options including tray or reel-to-reel delivery methods.

As a cutting-edge packaging technology, Fan-Out Packaging primarily achieves higher-density electrical interconnections by redistributing and connecting the input/output (I/O) pins on the chip to a wider external circuit. This technology offers distinct technical advantages including high integration density, excellent electrical performance, and superior thermal management.

Application Areas: Fan-Out Packaging is widely adopted in high-end electronic devices, particularly in: 5G communications, data centers, artificial intelligence processors, automotive electronics, internet of Things (IoT)，consumer electronics.

In these fields, its advantages are mainly reflected in: enhanced device performance, reduced power consumption, compact form factor and improved heat dissipation. These benefits make Fan-Out Packaging an indispensable solution in modern electronic technologies.

Design simulation is critically important for formulating and delivering advanced packaging solutions. It conducts fundamental simulation evaluations of packaging designs from stress, electrical performance, and thermal perspectives prior to prototyping, while collaborating with process, materials, and equipment teams to optimize packaging solutions. This capability is essential for high-end advanced packaging and testing facilities.

Before submitting customized Fan-out wafer-level advanced packaging solutions to production lines for manufacturing, professional EDA engineering software tools must first perform simulations for preliminary verification and optimization. This ensures the final packaging solution meets customer performance requirements for the packaged chips or modules. Typical simulations mainly include the following aspects:

1. Mechanical Simulation: Mechanical strength of packaged chip modules, warpage of reconstituted wafers, stress distribution, etc.
2. Thermal Simulation: Heat generation and temperature distribution of packaged chip modules under specified power conditions.
3. Electrical Simulation: Power consumption, RF transmission efficiency, noise interference, signal integrity, and power integrity of chip modules, etc.