Products and Services
Bumping
Wafer bumping is an advanced wafer-level packaging technology that uses copper pillar/solder bump interconnections between the chip and its package. It is an alternative to traditional wire bonding technology. Microsilicon Technology is capable of providing 8-inch and 12-inch wafer bumping foundry services to customers, including high-density and high-copper pillar electroplating bumps and fine-pitch redistribution with ball-attachment technology to meet different customer needs.
Products and Services
Bumping
Wafer bumping is an advanced wafer-level packaging technology that uses copper pillar/solder bump interconnections between the chip and its package. It is an alternative to traditional wire bonding technology. Microsilicon Technology is capable of providing 8-inch and 12-inch wafer bumping foundry services to customers, including high-density and high-copper pillar electroplating bumps and fine-pitch redistribution with ball-attachment technology to meet different customer needs.
Products and Services
WLCSP
Wafer bumping is an advanced wafer-level packaging technology that uses copper pillar/solder bump interconnections between the chip and its package. It is an alternative to traditional wire bonding technology. Microsilicon Technology is capable of providing 8-inch and 12-inch wafer bumping foundry services to customers, including high-density and high-copper pillar electroplating bumps and fine-pitch redistribution with ball-attachment technology to meet different customer needs.
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Building 5, 6th Floor, Haichuang Green Valley Center, No. 1999, YuHang Tang Road, Wuchang Street, Yuhang District, Hangzhou City
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No. 29, Xinchi Road, Chengnan Economic Development Zone, Gaoyou City, Yangzhou City
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