Job Responsibilities

1. Develop personal sales targets and plans in accordance with company objectives;

2. Grasp market trends and conduct market development;

3. Establish and maintain long-term communication and contact with clients. Master overall client information and development trends, analyze client needs, convey product and technical information, and ultimately achieve sales goals;

4. Collaborate with NPI to provide clients with optimal packaging solutions;

5. Track and follow up on customer satisfaction.

Job Requirements

1. Bachelor's degree or above, more than 2 years of sales experience in the semiconductor industry, packaging industry background preferred;

2. Familiar with the packaging needs of IC design companies;

3. Familiar with the packaging of modules such as IoT and smart wearables;

4. Familiar with advanced semiconductor packaging, familiar with Fan-Out Wafer Level Packaging (FOWLP), Bumping/WLCSP/SiP preferred.

5. Able to independently develop markets.

I. Job Responsibilities

1. Responsible for the full life cycle management of wafer-level packaging technology products, including the entire process from product concept proposal, planning, design, and development to mass production and after-sales.

2. Work closely with cross-departmental teams such as R&D, production, and sales to ensure product development progress and quality, and coordinate to solve technical problems and issues in project advancement.

3. Deeply understand market demand and industry trends, collect and analyze customer feedback, promote continuous product optimization and innovation, and enhance product competitiveness.

4. Develop product technology roadmaps, participate in technology selection and scheme evaluation, and control the direction of product technology.

5. Responsible for product cost control and benefit analysis, formulate reasonable pricing strategies, and ensure the commercial success of products.

II. Job Requirements

1. Bachelor's degree or above in electronics, materials, semiconductors, or related majors.

2. 3+ years of working experience in the semiconductor packaging industry, with experience in wafer-level packaging technology preferred.

3. Familiar with product development processes, with excellent project management capabilities and technical problem-solving skills.

4. Possess keen market insight and good communication and coordination skills, able to effectively cooperate with different departments.

5. Possess strong learning ability and innovative awareness, able to quickly adapt to industry changes and technological development.

Job Responsibilities:

1. Responsible for the development of new processes for the introduction of new products, including communication and coordination with customers and relevant internal departments. Responsible for project planning, coordinating product design, cost analysis, material preparation, sample production, reliability testing, and small-batch trial production. Ensure the smooth execution and implementation of project plans.

3. Lead new product trial production meetings and follow up on and improve trial production abnormalities.

3. Cooperate with customers to successfully introduce new product production, meet customer needs, and confirm product delivery methods with customers.

4. Lead the establishment and maintenance of product documents, and product design changes and control.

5. Responsible for customer data review, customer delivery date confirmation, exception handling, customer relationship maintenance, and customer reception.

Job Requirements:

1. Bachelor's degree or above in computer science, electronics, microelectronics, physics, or other engineering disciplines.

2. At least 3 years or more of wafer-level Fan-in, Fan-out NPI work experience.

3. Wafer-level packaging process experience is preferred.

4. Strong communication skills and ability to analyze and handle exceptions.

5. Ability to optimize product processes, coordinate and organize, and coordinate with relevant departments.

6. Good at innovation, strong ability to withstand pressure, strong sense of responsibility and teamwork

Job Responsibilities

1. Develop and improve process specifications for reconstruction processes (SMT, Molding, debonding, etc.);

2. Optimize process parameters to reduce raw material consumption and improve machine capacity while ensuring quality;

3. Cooperate with other departments to develop and introduce new products, and provide production line training;

4. Introduce new processes and materials to improve process levels;

5. Responsible for the daily maintenance and improvement of processes, and the daily maintenance and improvement of SPC;

6. Responsible for writing and improving SOPs for related processes and machine operations in the area;

7. Responsible for the management and optimization of product-related machine recipes;

8. Cooperate with cost reduction and process optimization to improve production efficiency

Job Requirements

1. Bachelor's degree or above in Mechatronics, Semiconductor, Applied Electronics, Physics, Mechanical Electronics, or related majors;

2. 2 years or more of experience in SMT/Molding/Debonding packaging.

Job Responsibilities:

1. Assist NPI engineers in identifying and recording issues during the new product introduction process, and keep records for future reference;

2. Maintain the normal operation of the MES system and ERP system;

3. Write and update relevant department SOPs;

4. Coordinate internally with NPI engineers, and externally with sales (sales assistants), warehouse, and process departments;

Requirements:

1. Bachelor's degree or above;

2. Basic understanding of the structure of FMEA&CP&SOP documents;

3. Proficient in various office software;

4. Meticulous, with good communication skills

Job Responsibilities:

1. Participate in the research and development of new company products/processes and the improvement of existing products/processes.

2. Cooperate with R&D engineers to conduct sample testing, data collection, and process experiments.

3. Assist in solving various problems encountered during the R&D process.

4. Responsible for the organization, summarization, and archiving of relevant data files.

5. Responsible for tracking the progress of R&D products.

6. Complete other tasks assigned by the department manager and company leaders.

Job Requirements:

1. Bachelor's degree or above, science and engineering background. Electronics, chemistry, mechanics, physics, packaging engineering, etc. are preferred;

2. Strong adaptability, teamwork spirit, and a strong sense of responsibility, as well as the ability to continuously learn;

3. Strong hands-on ability, those with independent thinking and problem-solving skills are preferred;

4. Identify with the company's culture and have a stable personality.